Manos Tentzeris was born and grew up in Piraeus, Greece. He graduated from Ionidios Model School of Piraeus in 1987 and he received the Diploma degree in Electrical Engineering and Computer Science (Magna Cum Laude) from the National Technical University in Athens, Greece, in 1992 and the M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor in 1993 and 1998. He is currently a Professor with the School of ECE, Georgia Tech and he has published more than 550 papers in refereed Journals and Conference Proceedings, 4 books and 23 book chapters, while he is in the process of writing 1 book. He has served as the Head of the Electromagnetics Technical Interest Group of the School of ECE, Georgia Tech. Also, he has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Also, Dr. Tentzeris is the Head of the A.T.H.E.N.A. Research Group (20 students and researchers) and has established academic programs in 3D Printed RF electronics and modules, flexible electronics, origami and morphing electromagnetics, Highly Integrated/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, paper-based RFID 's and sensors, inkjet-printed electronics, nanostructures for RF, wireless sensors, power scavenging and wireless power transfer, Microwave MEM 's, SOP-integrated (UWB, mutliband, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD, MultiResolution Algorithms). He was the 1999 Technical Program Co-Chair of the 54th ARFTG Conference and he is currently a member of the technical program committees of IEEE-IMS, IEEE-AP and IEEE-ECTC Symposia. He was the TPC Chair for the IMS 2008 Conference and the Co-Chair of the ACES 2009 Symposium. He was the Chairman for the 2005 IEEE CEM-TD Workshop. He was the Chair of IEEE-CPMT TC16 (RF Subcommittee) and he was the Chair of IEEE MTT/AP Atlanta Sections for 2003. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and Chair of the newly formed IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE C-RFID DIstinguished Lecturers and he has served as one IEEE MTT-Distinguished Microwave Lecturers (DML) from 2010-2012. His hobbies include basketball, swimming, ping-pong and travel.

Shu Takayama earned his BS and MS in Agricultural Chemistry at the University of Tokyo. He earned a Ph.D. in Chemistry at The Scripps Research Institute in La Jolla, California studying bio-organic synthesis with Dr. Chi‐Huey Wong. He then worked as a postdoc with Dr. George Whitesides at Harvard University where he focused on applying microfluidics to studying cell and molecular biology.

Takayama began his career at the University of Michigan, where led his lab in the Department of Biomedical Engineering and Macromolecular Science & Engineering for over 17 years. In 2017, the lab moved to Georgia Tech where Shu became the Georgia Research Alliance Price Gilbert Chair Professor of Biomedical Engineering in the Wallace H. Coulter Department of Biomedical Engineering.

Takayama’s research interests are diverse and motivated by clinical and biotechnology needs. He is always interested in hearing from stakeholders in these areas who are seeking engineering collaboration.

Todd Sulchek is an associate professor in Mechanical Engineering at Georgia Tech where he conducts fundamental and applied research in the field of biophysics. His research program focuses on the mechanical and adhesive properties of cell and biological systems and the development of microsystems to aid in their study. His research employs tools, including, MEMS, microfluidics, imaging, and patterning to understand or enable biological systems. His interests include cancer diagnostics, stem cell biomanufacturing, novel therapeutics, and ultracheap engineering tools. He is a member of the interdisciplinary Institute for Bioengineering and Bioscience. Dr. Sulchek also holds program faculty positions in Bioengineering and Biomedical Engineering and has a courtesy appointment in the School of Biology. He received his Ph.D. from Stanford in Applied Physics under Calvin Quate and received a bachelors in math and physics from Johns Hopkins. He was a postdoc and staff scientist at Lawrence Livermore National Lab. He joined Georgia Tech in 2008 as an Assistant Professor of Mechanical Engineering. He is a recipient of the NSF CAREER award, the BP Junior Faculty Teaching Excellence Award, the Lockheed Inspirational Young Faculty award, and the 2012 Petit Institute Above and Beyond Award. To date he has published 42 journal papers and has filed or been issued 7 patents. Prof. Sulchek is a strong supporter of undergraduate research, and he participates in a variety of undergraduate education activities including the Undergraduate Research Opportunities Program (UROP) and includes over 8 undergraduate authors in the past year.

Suresh Sitaraman is a Professor in the George W. Woodruff School of Mechanical Engineering, and leads the Flexible Hybrid Electronics Initiative at Georgia Tech and directs the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab at Georgia Tech. He is a Thrust Leader/Faculty Member, Reliability/Mechanical Design Research, 3D Systems Packaging Research Center; a Faculty Member, Georgia Tech Manufacturing Institute; a Faculty Member, Interconnect and Packaging Center, an SRC Center of Excellence, Institute for Electronics and Nanotechnology; a Faculty Member, Nanoscience and Nanotechnology, Nanotechnlogy Research Center, Institute for Electronics and Nanotechnology; a Faculty Member, Institute of Materials. Dr. Suresh Sitaraman's research is exploring new approaches to develop next-generation microsystems. In particular, his research focuses on the design, fabrication, characterization, modeling and reliability of micro-scale and nano-scale structures intended for microsystems used in applications such as aerospace, automotive, computing, telecommunicating, medical, etc. Sitaraman's research is developing physics-based computational models to design flexible as well as rigid microsystems and predict their warped geometry and reliability. His virtual manufacturing tools are able to simulate sequential fabrication and assembly process mechanics to be able to enhance the overall yield, even before prototypes are built. Sitaraman's work is developing free-standing, compliant interconnect technologies that can mechanically decouple the chip from the substrate without compromising the overall electrical functionality. This work is producing single-path and multi-path interconnect technologies as well as nanowire and carbon nanotube interconnects for electrical and thermal applications, and such interconnect technologies can be employed in flexible as well as 3D microelectronic systems. Sitaraman's research is also developing innovative material characterization techniques such as the stressed super layer technique as well as magnetic actuation test that can be used to study monotonic and fatigue crack propagation in nano- and micro-scale thin film interfaces. In addition, Sitaraman has developed fundamental modeling methodologies combined with leading-edge experimentation techniques to study delamination in the dielectric material and copper interface used in back-end-of-the-line (BEOL) stacks and through-silicon vias as well as epoxy/copper and epoxy/glass interfaces as in microelectronic packaging and photovoltaic module applications. Examining the long-term operational as well as accelerated thermal cycling reliability of solder interconnects, his work has direct implications in implantable medical devices, photovoltaic modules, computers and smart devices as well as rugged automobile and aerospace applications. Through the above-mentioned fundamental and applied research and development pursuits, Sitaraman's work aims to address some of the grand challenges associated with clean energy, health care, personal mobility, security, clean environment, food and water, and sustainable infrastructure

Arijit Raychowdhury is currently an Professor in the School of Electrical and Computer Engineering at the Georgia Institute of Technology where he joined in January, 2013. He received his Ph.D. degree in Electrical and Computer Engineering from Purdue University (2007) and his B.E. in Electrical and Telecommunication Engineering from Jadavpur University, India (2001). His industry experience includes five years as a Staff Scientist in the Circuits Research Lab, Intel Corporation, and a year as an Analog Circuit Designer with Texas Instruments Inc. His research interests include low power digital and mixed-signal circuit design, design of power converters, sensors and exploring interactions of circuits with device technologies. Raychowdhury holds more than 25 U.S. and international patents and has published over 80 articles in journals and refereed conferences. He serves on the Technical Program Committees of DAC, ICCAD, VLSI Conference, and ISQED and has been a guest associate-editor for JETC. He has also taught many short courses and invited tutorials at multiple conferences, workshops and universities. He is the winner of the Intel Labs Technical Contribution Award, 2011; Dimitris N. Chorafas Award for outstanding doctoral research, 2007; the Best Thesis Award, College of Engineering, Purdue University, 2007; Best Paper Awards at the International Symposium on Low Power Electronic Design (ISLPED) 2012, 2006; IEEE Nanotechnology Conference, 2003; SRC Technical Excellence Award, 2005; Intel Foundation Fellowship, 2006; NASA INAC Fellowship, 2004; M.P. Birla Smarak Kosh (SOUTH POINT) Award for Higher Studies, 2002; and the Meissner Fellowship 2002. Raychowdhury is a Senior Member of the IEEE

The Raman Group has two main thrusts.  The team utilizes sophisticated tools to cool atoms to temperatures less than one millionth of a degree above absolute zero. Using these tools, they explore topics ranging from superfluidity in Bose-Einstein condensates (BECs) to quantum antiferromagnetism in a spinor condensate.  In another effort the team partners with engineers to build cutting edge atomic quantum sensors on-chip that can one day be mass-produced.

Stephen E. Ralph is a Professor with the School of Electrical and Computer Engineering at Georgia Tech. He received the BEE degree in Electrical Engineering with highest honors from the Georgia Institute of Technology in 1980. He received a Ph.D. in Electrical Engineering from Cornell University in 1988 for his work on highly nonequilibrium carrier transport in semiconductor devices. He is currently the director of the Georgia Electronic Design Center, a cross-disciplinary electronics and photonics research center focused on the synergistic development of high-speed electronic components and signal processing to enable revolutionary system performance. He is also the founder and director of the new Terabit Optical Networking Consortium, an industry led communications and information technology consortium. Prior to Georgia Tech he held a postdoctoral position at AT&T Bell Laboratories and was a visiting scientist with the Optical Sciences Laboratory at the IBM T. J. Watson research center. He has widely published in peer-reviewed journals and conferences and holds more than 10 patents in the fields of optical communications, optical devices and signal processing. His current research focuses on high-speed optical communications systems including modulation formats, coherent receivers, microwave photonics, integrated photonics and signal processing. Ralph is an Associate Editor of the IEEE Transactions on Electronic Devices. He is a Fellow of the Optical Society (OSA).