Zhu's research focuses on the modeling and simulation of mechanical behavior of materials at the nano- to macroscale. Some of the scientific questions he is working to answer include understanding how materials fail due to the combined mechanical and chemical effects, what are the atomistic mechanisms governing the brittle to ductile transition in crystals, why the introduction of nano-sized twins can significantly increase the rate sensitivity of nano-crystals, and how domain structures affect the reliability of ferroelectric ceramics and thin films. To address these problems, which involve multiple length and time scales, he has used a variety of modeling techniques, such as molecular dynamics simulation, reaction pathway sampling, and the inter-atomic potential finite-element method. The goal of his research is to make materials modeling predictive enough to help design new materials with improved performance and reliability.

W. Hong Yeo is a TEDx alumnus and biomechanical engineer. Since 2017, Yeo is an assistant professor of the George W. Woodruff School of Mechanical Engineering and Program Faculty in Bioengineering at the Georgia Institute of Technology. Before joining Georgia Tech, he has worked at Virginia Commonwealth University Medicine and Engineering as an assistant professor from 2014-2016. Yeo received his BS in mechanical engineering from INHA University, South Korea in 2003 and he received his Ph.D. in mechanical engineering and genome sciences at the University of Washington, Seattle in 2011. From 2011-2013, he worked as a postdoctoral research fellow at the Beckman Institute and Frederick Seitz Materials Research Laboratory at the University of Illinois at Urbana-Champaign. His research focuses on the fundamental and applied aspects of nanomechanics, biomolecular interactions, soft materials, and nano-microfabrication for nanoparticle biosensing and unusual electronic system development, with an emphasis on bio-interfaced translational nanoengineering. is an Editorial Board Member of Scientific Reports (Nature Publishing Group) and Scientific Pages of Bioengineering, and Review Editor of Frontiers of Materials (Frontiers Publishing Group). He serves as a technical committee member for IEEE Electronic Components and Technology Conference and Korea Technology Advisory Group at Korea Institute for Advancement of Technology. He has published more than 40 peer-reviewed journal articles, and has three issued and more than five pending patents. His research has been funded by MEDARVA Foundation, Thomas F. and Kate Miller Jeffress Memorial Trust, CooperVision, Inc., Korea Institute of Materials Science, Commonwealth Research Commercialization, and State Council of Virginia. Yeo is a recipient of a number of awards, including BMES Innovation and Career Development Award, Virginia Commercialization Award, Blavatnik Award Nominee, NSF Summer Institute Fellowship, Notable Korean Scientist Awards, and Best Paper/Poster Awards at ASME conferences.

Eric M. Vogel is currently professor of Materials Science and Engineering at the Georgia Institute of Technology. Prior to joining Tech in August 2011, he was an associate professor of Materials Science and Engineering and electrical engineering at the University of Texas at Dallas (UT Dallas) where he was also associate director of the Texas Analog Center of Excellence and led UT Dallas's portion of the Southwest Academy for Nanoelectronics. Prior to joining UT Dallas in August of 2006, he was leader of the Semiconductors and Novel Devices Group and founded the Nanofab at the National Institute of Standards and Technology. He received his Ph.D. in 1998 in electrical engineering from North Carolina State University and his B.S. in 1994 in electrical engineering from Penn State University. Professor Vogel's research interests relate to materials and devices for future micro-/nano-electronics. He has published over 150 journal publications and proceedings, written six book chapters and given over 75 invited talks and tutorials.

Manos Tentzeris was born and grew up in Piraeus, Greece. He graduated from Ionidios Model School of Piraeus in 1987 and he received the Diploma degree in Electrical Engineering and Computer Science (Magna Cum Laude) from the National Technical University in Athens, Greece, in 1992 and the M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor in 1993 and 1998. He is currently a Professor with the School of ECE, Georgia Tech and he has published more than 550 papers in refereed Journals and Conference Proceedings, 4 books and 23 book chapters, while he is in the process of writing 1 book. He has served as the Head of the Electromagnetics Technical Interest Group of the School of ECE, Georgia Tech. Also, he has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Also, Dr. Tentzeris is the Head of the A.T.H.E.N.A. Research Group (20 students and researchers) and has established academic programs in 3D Printed RF electronics and modules, flexible electronics, origami and morphing electromagnetics, Highly Integrated/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, paper-based RFID 's and sensors, inkjet-printed electronics, nanostructures for RF, wireless sensors, power scavenging and wireless power transfer, Microwave MEM 's, SOP-integrated (UWB, mutliband, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD, MultiResolution Algorithms). He was the 1999 Technical Program Co-Chair of the 54th ARFTG Conference and he is currently a member of the technical program committees of IEEE-IMS, IEEE-AP and IEEE-ECTC Symposia. He was the TPC Chair for the IMS 2008 Conference and the Co-Chair of the ACES 2009 Symposium. He was the Chairman for the 2005 IEEE CEM-TD Workshop. He was the Chair of IEEE-CPMT TC16 (RF Subcommittee) and he was the Chair of IEEE MTT/AP Atlanta Sections for 2003. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and Chair of the newly formed IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE C-RFID DIstinguished Lecturers and he has served as one IEEE MTT-Distinguished Microwave Lecturers (DML) from 2010-2012. His hobbies include basketball, swimming, ping-pong and travel.

Shu Takayama earned his BS and MS in Agricultural Chemistry at the University of Tokyo. He earned a Ph.D. in Chemistry at The Scripps Research Institute in La Jolla, California studying bio-organic synthesis with Dr. Chi‐Huey Wong. He then worked as a postdoc with Dr. George Whitesides at Harvard University where he focused on applying microfluidics to studying cell and molecular biology.

Takayama began his career at the University of Michigan, where led his lab in the Department of Biomedical Engineering and Macromolecular Science & Engineering for over 17 years. In 2017, the lab moved to Georgia Tech where Shu became the Georgia Research Alliance Price Gilbert Chair Professor of Biomedical Engineering in the Wallace H. Coulter Department of Biomedical Engineering.

Takayama’s research interests are diverse and motivated by clinical and biotechnology needs. He is always interested in hearing from stakeholders in these areas who are seeking engineering collaboration.

Todd Sulchek is an associate professor in Mechanical Engineering at Georgia Tech where he conducts fundamental and applied research in the field of biophysics. His research program focuses on the mechanical and adhesive properties of cell and biological systems and the development of microsystems to aid in their study. His research employs tools, including, MEMS, microfluidics, imaging, and patterning to understand or enable biological systems. His interests include cancer diagnostics, stem cell biomanufacturing, novel therapeutics, and ultracheap engineering tools. He is a member of the interdisciplinary Institute for Bioengineering and Bioscience. Dr. Sulchek also holds program faculty positions in Bioengineering and Biomedical Engineering and has a courtesy appointment in the School of Biology. He received his Ph.D. from Stanford in Applied Physics under Calvin Quate and received a bachelors in math and physics from Johns Hopkins. He was a postdoc and staff scientist at Lawrence Livermore National Lab. He joined Georgia Tech in 2008 as an Assistant Professor of Mechanical Engineering. He is a recipient of the NSF CAREER award, the BP Junior Faculty Teaching Excellence Award, the Lockheed Inspirational Young Faculty award, and the 2012 Petit Institute Above and Beyond Award. To date he has published 42 journal papers and has filed or been issued 7 patents. Prof. Sulchek is a strong supporter of undergraduate research, and he participates in a variety of undergraduate education activities including the Undergraduate Research Opportunities Program (UROP) and includes over 8 undergraduate authors in the past year.

Suresh Sitaraman is a Professor in the George W. Woodruff School of Mechanical Engineering, and leads the Flexible Hybrid Electronics Initiative at Georgia Tech and directs the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab at Georgia Tech. He is a Thrust Leader/Faculty Member, Reliability/Mechanical Design Research, 3D Systems Packaging Research Center; a Faculty Member, Georgia Tech Manufacturing Institute; a Faculty Member, Interconnect and Packaging Center, an SRC Center of Excellence, Institute for Electronics and Nanotechnology; a Faculty Member, Nanoscience and Nanotechnology, Nanotechnlogy Research Center, Institute for Electronics and Nanotechnology; a Faculty Member, Institute of Materials. Dr. Suresh Sitaraman's research is exploring new approaches to develop next-generation microsystems. In particular, his research focuses on the design, fabrication, characterization, modeling and reliability of micro-scale and nano-scale structures intended for microsystems used in applications such as aerospace, automotive, computing, telecommunicating, medical, etc. Sitaraman's research is developing physics-based computational models to design flexible as well as rigid microsystems and predict their warped geometry and reliability. His virtual manufacturing tools are able to simulate sequential fabrication and assembly process mechanics to be able to enhance the overall yield, even before prototypes are built. Sitaraman's work is developing free-standing, compliant interconnect technologies that can mechanically decouple the chip from the substrate without compromising the overall electrical functionality. This work is producing single-path and multi-path interconnect technologies as well as nanowire and carbon nanotube interconnects for electrical and thermal applications, and such interconnect technologies can be employed in flexible as well as 3D microelectronic systems. Sitaraman's research is also developing innovative material characterization techniques such as the stressed super layer technique as well as magnetic actuation test that can be used to study monotonic and fatigue crack propagation in nano- and micro-scale thin film interfaces. In addition, Sitaraman has developed fundamental modeling methodologies combined with leading-edge experimentation techniques to study delamination in the dielectric material and copper interface used in back-end-of-the-line (BEOL) stacks and through-silicon vias as well as epoxy/copper and epoxy/glass interfaces as in microelectronic packaging and photovoltaic module applications. Examining the long-term operational as well as accelerated thermal cycling reliability of solder interconnects, his work has direct implications in implantable medical devices, photovoltaic modules, computers and smart devices as well as rugged automobile and aerospace applications. Through the above-mentioned fundamental and applied research and development pursuits, Sitaraman's work aims to address some of the grand challenges associated with clean energy, health care, personal mobility, security, clean environment, food and water, and sustainable infrastructure